Electrical & electronic component testing
Reliable analysis of thermal anomalies in electronic components.
Lock-in thermography enables precise identification of defects such as hotspots, short circuits, and material inhomogeneities in electronic components – contact-free, non-destructive, and suitable for inline integration.
How it works — explained in a nutshell
Lock-in thermography uses modulated thermal pulses to analyze heat flow in electronic components. Defects alter the heat flow and generate characteristic temperature patterns that are detected by infrared cameras. The method is contact-free, residue-free, and can be seamlessly integrated into existing production lines.
Why Use Lock-in Thermography for Electronic Component Inspection?
The quality of electronic components is crucial for the functionality and safety of devices. Lock-in thermography enables fast, contact-free, and non-destructive evaluation of these components. Traditional methods such as visual inspection or electrical testing are often time-consuming, require special safety precautions, and are not always suitable for inline integration.
Thermographic Solution
Defects alter the heat flow, leading to local temperature variations. These variations are captured and analyzed by an infrared camera.
The method is based on lock-in thermography, which is explained in the following link using the example of optical excitation.
FAQ
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